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Thermal Interface Materials (TIM)

29 June 2020

Nordson EFD innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. 

Conventional, silicone-based thermal compound and greases tend to spread after a number of heating and cooling cycles (so called pump-out), creating voids, and losing effectiveness, leading to overheating of electronic components and premature product failure.

Our synthetic-based, silicone-free thermal interface materials resist degradation caused by thermal cycling, which makes them suitable for use in a wide range of electronic and electromechanical applications. Depending on application requirements, users can choose from a wide array of formulas, each with unique features and benefits.

Specialty Features

  • High-temperature operation at 250° C continuous
  • Low/no outgassing for vacuum environments
  • High dielectric strength
  • Easy to clean: water while retaining good moisture resistance
  • Ultra-thin bond line for minimum thermal resistance

As a complete TC dispensing solution, Nordson EFD offers the 794-TC Series auger dispense valve which can be supplied with thermal compounds from prefilled syringe barrels or cartridges.

Contact: Nordson EFD, Dunstable, U.K. (0) 1582 666334, uk@nordsonefd.com

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Industry Connections: EFD International


 
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