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Electrons, not ions, provide superior plasma etching of nanoscale semiconductor devices
In semiconductor fabrication, the traditional approach to dry etching has been to utilise RF plasma to bombard the surface of the wafer with positive ions to remove material between masking layers.
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Octavo Systems introduces its latest SoC to simplify design
Octavo Systems has expanded its support of the OSD32MP15x System in Package with a production release at speeds up to 800MHz, and two new development boards.
The OSD32MP15x System in Package has ...
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