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Shorter time-to-market with latest COM technology

Claus Giebert, Business Development Manager, Advantech

It is well documented that faster application development and shorter time-to-market can provide significant business value, but only if ... more

TE launches with SUPERSEAL pro connectors for vehicles
	The commercial vehicle market is requiring manufacturers to extend the capabilities of commercial vehicle solutions to include greater efficiency and performance, especially in the area of sealed ... more

Cleaning industrial parts with pressure plasma
	The cleanliness of functional and connecting surfaces is critical for the quality of subsequent processes like bonding, coating and printing. That’s why manufacturers may want to consider using ... more

Low temperature curing with DOWSIL VE-8001 adhesive

Dow has introduced the new DOWSIL VE-8001 Flexible Silicone Adhesive for flexible and foldable displays, smartphones, wearables, laptops, televisions and many other types of electronic devices.

... more

Altus conformal coating for cleaning trouble-free
	Conformal coatings are very important if printed circuit boards are to operate reliably in harsh environments. Choosing the correct material for this process is carefully considered during production. more

Electrons, not ions, provide superior plasma etching of nanoscale semiconductor devices	Octavo Systems introduces its latest SoC to simplify design
In semiconductor fabrication, the traditional approach to dry etching has been to utilise RF plasma to bombard the surface of the wafer with positive ions to remove material between masking layers. ... more	Octavo Systems has expanded its support of the OSD32MP15x System in Package with a production release at speeds up to 800MHz, and two new development boards. The OSD32MP15x System in Package has ... more

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January 2021