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EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Published: 15 March 2018 - Sarah Mead

Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials, is pleased to introduce the availability of its DF-3500 series dry-film negative photoresists for wafer level sealing of through-silicon vias. This material formulation has been optimised for hot roll lamination and processing on MEMS and IC wafers.

The DF-3500 series resists can be used as via caps or as a continuous passivation layer. When used in conjunction with the 412-17 EMS adhesion promoter, the resist is capable of surviving HAST testing on sealed vias. These dry-films are capable of extreme fine line and space definition in complex patterns with resolutions down to 3um for the thinnest films. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.

EMS DF-3500 dry-film photoresists are tougher (less brittle) than other negative photoresists on the market with glass transition temperatures ranging from 120°C (by DMA Tan Delta) to 200°C. They are hydrophobic in nature, providing chemical and moisture resistance. EMS dry-films are compatible with and can be used in contact with the EMS line of spin-coatable negative tone photoresists.

The DF-3500 series film negative photoresists are the latest addition to Engineered Materials Systems’ full line of film and liquid negative photoresists formulated for lift off processes, via sealing and making microfluidic channels on MEMS devices.

For more information about the dry film negative photoresist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.



 
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