READ THE LATEST
DIGITAL ISSUE

you can view
archived issues

Micro Matters

Skip over navigation

Site search Advanced

Magazine Registration

Newsletter Sign-up

Latest Newsletter

Tweets by @ci_micro

Microelectronics Research & Development

[title]

[anons] [more]

[anonsimg]

[category_title]

[date_prefix][date][time] [comment_num_prefix] [comment_num]

[title]
[anonsimg]	[anons] [more]

[date_prefix][date][time][author]

[magazine][category_title]

[comment_num_prefix] [comment_num]

[title]	[title]
[anonsimg] [anons] [more]	[anonsimg] [anons] [more]
[category_title]	[category_title]

Marquardt puts pedal to the metal with DELO adhesives

They are the secret stars of [SM(2] technical products. Whether in the automotive sector, mechanical engineering, white goods or tools: Microswitches that detect On and Off reliably are essential for ... more

World Premier of Nano Dimension’s DragonFly 2020 Pro 3D Printer for Advanced Additive Manufacturing of Electronics at productronica and IDTechEx
	First of its kind DragonFly 2020 Pro 3D eliminates the bottlenecks and process inefficiencies in electronics development, accelerating the way innovative products are designed, tested and brought to ... more

New measuring flange with integrated speed and angle measurement
	The new Kistler KiTorq torque measuring flange is now available in eight ranges from 50Nm to 5000Nm and with speed and angular measurement capability. more

New Helios G4 Series DualBeam from FEI sets new standards
	First 7nm TEM preparation solution available to failure analysis labs and the only DualBeam of its kind to achieve sub-three Ångström resolution. more

CPI part of consortium to develop intelligent packaging for pharmaceuticals
	The project titled ‘REMEDIES’, launched in 2014 and due for completion March 2018 more

Morgan Advanced Materials unveils 3D engineered super insulation solution	Altera and TSMC announce industry-first, UBM-free WLCSP packaging technology platform
Morgan Advanced Materials has revealed its latest super-insulation technology in the form of WDS UltraShell. The new product, WDS UltraShell, is a high-performance, rigid microporous machined shell ... more	Altera and TSMC have announced the two companies have produced a UBM-free (under-bump metallisation-free) WLCSP (wafer-level chip scale package) technology that provides enhanced quality, reliability ... more

TSMC certifies Synopsys design tools
	Synopsys has announced that TSMC has concluded 16 nanometer FinFET Plus (16FF+) v1.0 certification and reached the first milestone of 10nanometer (nm) certification based on the most current DRM and ... more

Nanostructured monoclinic zirconia from Innovnano provides high quality, long-lasting refractories
	Innovnano, an expert manufacturer of high performance ceramic powders, has developed nanostructured monoclinic zirconia with enhanced properties for use as a sintering aid in the production of high ... more

Supercomputers in materials science: First-principles simulation of large molecules
	Matter is composed of large numbers of atoms, and its physical properties are determined by the nature of the complex forces between atoms and electrons. Theoreticians use quantum mechanics to ... more


Search for a product/supplier:

-

January 2020

+

S

M

T

W

T

F

S

29

30

31

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

1

2

3

4

5

6

7

8

2017

2016

Privacy Policy | Terms & Conditions | Site Map | Feedback |

© 2012 - 2020 Datateam Business Media Ltd. All rights reserved. Registered in England No: 1771113.
Registered Office: 15A London Road,
Maidstone, Kent, ME16 8LY.