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Micro-STX SBC has high density graphics capability

12 July 2018

Designed to provide high density multi-processor / GPU combinations in graphics intensive applications such as simulators and VR systems the MXM IPC-Q170 from BVM Limited uses an MXM graphics module to achieve maximum performance. The focus on high performance graphics performance makes the IPC-Q170 an outstanding choice as the computing engine for applications such as flight and marine training simulators where multiple CPUs and graphics cards are networked together to generate large photo-realistic multiple panel displays.

The ASRock MXM IPC-Q170 is a Micro-STX (5.8 x 7.4 inch) SBC, supporting 7th Generation Kaby Lake i7/i5/i3 and Celeron processors combined with the Q170 chipset and with up to 32GB 2400MHz DDR4 system memory. The unit is optimised around the increasingly popular open standard MXM graphics card interface, originally developed by market leader Nvidia, but supported by others. The IPC-Q170 offers five DisplayPorts – one from CPU and four from an external MXM Type B card; an eDP port is also available from the CPU and HexaDisplay Multi Display is supported.

Two Gigabit Ethernet ports and four USB3.0 ports are provided. Mass storage is enabled through two SATA3 ports and a M.2 Key M expansion port supports a PCIe x 4 port and a SATA3 SSD. Alternatively a key E M.2 port offers a PCIe x 1 port and a USB2.0 port for wireless interconnect. Power is from an external 19VDC PSU.

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Industry Connections: BVM Ltd

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