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New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for World-class MIPI-based Embedded Vision Systems

CrossLinkPlus family combines FPGA flexibility with instant-on panel display performance, accelerating designs in industrial, automotive, computing, and consumer applications

Lattice Semiconductor ... more

New 0.5Amp Large PXI Matrix Modules from Pickering Interfaces have up to 6,144 Crosspoints

39% higher density than competing modules;

Enables complete functional ATE in a 3U PXI chassis Pickering Interfaces, a leading provider of modular signal switching and simulation for electronic ... more

Mouser Electronics Signs Global Agreement with SEARAN to Offer Bluetooth SDKs for Multiple OS

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, today announces a global distribution agreement with SEARAN, a fast-growing ... more

New beam angle LEDs from OMC focus light precisely for demanding high-intensity applications

Ultra-narrow 15 degree LED and precision 60 degree LEDs suit signalling, indication, sensing and communication applications

OMC, the pioneer in optoelectronics design & manufacture, has ... more

Rugged, modular MIL 83513 1.27mm pitch connector with captive fixings suits thick PCBs and AWG24 cable

Nicomatic’s easy-to-use EMM series suits harsh-environment defense applications

Nicomatic SA, the leading manufacturer of high-performance interconnect systems, has announced new features for its ... more

Blaize Emerges from Stealth to Transform AI Computing

Evatron IP68 Enclosures

Blaize, formerly known as Thinci, unveils the first true Graph-Native silicon architecture and software platform built to process neural networks and enable AI applications with unprecedented ... more
These High impact IP68 rated die cast enclosures are available in Natural Aluminium as well as powder coated Silver Grey and Black. Manufactured in corrosion resistant aluminium alloy with stainless ... more

Techsil launch new gap filling silicone paste with advanced thermal management properties

Electronic components in the future will be smaller, more powerful and more efficient. The higher energy density will translate to increased operating temperatures and more heat. In order to operate ... more

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-December 2019+