SMTconnect trade fair: Precise, repeatable temperature profiling
Published: 25 March 2019 - Sarah Mead
At the 2019 SMTconnect, Fluke Process Instruments will present its new Datapaq DP5 data loggers for inline temperature profiling in reflow soldering processes. Launched at last year’s show, the profilers are now in serial production. They are showcased along with a comprehensive array of system components building on the established Datapaq Reflow Tracker program, which also comprises a dedicated software suite.
These components include compact stainless-steel thermal barriers, thermocouples, and two sensor holding frames. These frames with fixed thermocouples save setup time and ensure high repeatability in monitoring process stability. The Datapaq Surveyor frame is designed to measure process performance at the critical board level. Together with the Insight Professional software, this tool detects trends in oven performance, allowing operators to take corrective action early on. The second sensor frame is a 12-thermocouple pallet for monitoring wave soldering process stability.
The pre-heat, chip wave, and wave soldering phases can all be analysed with one tool and one software. Analysis functions include maximum temperature, maximum slopes, contact time, and line speed. Users do not even have to wait for the profiler to exit the oven to visualise and analyse the data. An integrated radio transmitter optionally provides real-time data from within the process. All process and system data can also be communicated to factory-monitoring systems via the OPC interface.
Fluke Process Instruments at SMTconnect
Nuremberg, Germany, 7 – 9 May 2019
Hall 4, Stand 118