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Microelectronics Research & Development

New measuring flange with integrated speed and angle measurement

The new Kistler KiTorq torque measuring flange is now available in eight ranges from 50Nm to 5000Nm and with speed and angular measurement capability.  more

New Helios G4 Series DualBeam from FEI sets new standards

First 7nm TEM preparation solution available to failure analysis labs and the only DualBeam of its kind to achieve sub-three Ångström resolution. more

CPI part of consortium to develop intelligent packaging for pharmaceuticals

The project titled ‘REMEDIES’, launched in 2014 and due for completion March 2018 more

Morgan Advanced Materials unveils 3D engineered super insulation solution

Morgan Advanced Materials has revealed its latest super-insulation technology in the form of WDS UltraShell. The new product, WDS UltraShell, is a high-performance, rigid microporous machined shell ... more

Altera and TSMC announce industry-first, UBM-free WLCSP packaging technology platform

TSMC certifies Synopsys design tools

Altera and TSMC have announced the two companies have produced a UBM-free (under-bump metallisation-free) WLCSP (wafer-level chip scale package) technology that provides enhanced quality, reliability ... more
Synopsys has announced that TSMC has concluded 16 nanometer FinFET Plus (16FF+) v1.0 certification and reached the first milestone of 10nanometer (nm) certification based on the most current DRM and ... more

Nanostructured monoclinic zirconia from Innovnano provides high quality, long-lasting refractories

Innovnano, an expert manufacturer of high performance ceramic powders, has developed nanostructured monoclinic zirconia with enhanced properties for use as a sintering aid in the production of high ... more

Supercomputers in materials science: First-principles simulation of large molecules

Matter is composed of large numbers of atoms, and its physical properties are determined by the nature of the complex forces between atoms and electrons. Theoreticians use quantum mechanics to ... more
 
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