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Two New Gen 3 PXI Express (PXIe) Chassis from Pickering Interfaces Ensure Maximum PXI Application Flexibility

All hybrid, high-performance and low-cost for a broad range of applications

Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test ... more

Security Solution with New Mach-NX FPGA for Next Generation, Cyber-Resilient Systems

Adds Secure Enclave with Support for ECC 384 and SPDM Protocols, Increases System Control Customization Capabilities

Enables Hardware Root-of-Trust, PFR, and End-to-End Supply Chain Security Across ... more

Advertorials

How Can IoT Make Manufacturing Smarter?

In 2015, there were just 3.8 billion active Internet of Things (IoT) devices globally. By 2025, this number is expected to jump to over 21 billion connected IoT devices around the world.

The IoT ... more

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Castle Microwave & Cadence

Castle Microwave & Cadence

With long experience of providing simulation tool solutions to our customer base, Castle Microwave is now pleased to represent Cadence in the UK! With the ... more

RF & Microwave

How Can IoT Make Manufacturing Smarter?

How Can IoT Make Manufacturing Smarter?

In 2015, there were just 3.8 billion active Internet of Things (IoT) devices globally. By 2025, this number is expected to jump to over 21 billion connected ... more

News

“UNTACT” Contactless Infrared Touch & Industrial Touch Monitors

Panel PC with Core I7 Processor suitable for Industrial use

Craft Data, the UK & European representative for industrial touch & display specialist GTT Co. Ltd are pleased to introduce their latest range of hygienic, contactless touch frames & ... more
Panel PC with Core I7 Processor suitable for Industrial use

The new POS-Line V2 17.3” Panel PC Monitor with Core i7 Board and full HD resolution is available from Display Technology Ltd. One ... more

3D Power Packaging® for Low Power DC/DC converters

Modular board-mounted DC/DC converters must be ever-smaller and easier to place and solder. To achieve this, RECOM utilizes the ‘Z’ dimension in 3D Power Packaging (3DPP), stacking a PCB or leadframe ... more
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