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Marvell extends NVMe-oF Ethernet SSD

Marvell has announced an expansion of its NVMe over Fabrics (NVMe-oF) portfolio. Solutions include power the Toshiba Memory native NVMe-oF Ethernet solid state drive (SSD) with Marvell’s NVMe-oF SSD ... more

Conta-Clip introduces its latest series of communication modules

Conta-Clip introduces its GSM-PRO2 series of communication modules, fitted with a Modbus RTU (RS485) interface for ease of data exchange with other controllers. They're designed to provide a PLC with ... more

T-Mobile, Qualcomm and Ericsson signal the arrival of the future with 5G innovations

T-Mobile, Qualcomm Technologies and Ericsson have announced that they’ve achieved a low-band 5G data session on a commercial 5G modem. The data session was completed on a mobile test device, powered ... more

Winbond's latest multi-chip package supports 5G CPE modems

Winbond, supplier of semiconductor memory solutions, has launched their new flash memory product, the NAND+LPDDR4x multi-chip package, operating at 1.8V with 2Gb+2Gb die. It is hoped that it will ... more

500G single-wavelength connectivity trial is a success for SIAE MICROELECTTRONICA and Infinera

Infinera and SIAE MICROELETTRONICA, developers in wireless communications, have announced the success of a trial demonstrating how end-to-end, software-defined networking (SDN)-enabled service can ... more

Analog Devices announces breakthrough solution to accelerate mmWave 5G wireless network infrastructure

Analog Devices, Inc. (ADI), the industry leader in RF and Microwave technology and system design for 5G infrastructure, has introduced a new solution for millimetre wave (mmWave) 5G with the highest ... more

RFS launches 5G-Ready Dual Band Microwave Antennas as an alternative to fibre backhaul

Radio Frequency Systems (RFS), a global designer and manufacturer of package solutions for wireless and broadcast infrastructure, announces its family of innovative dual-band microwave antennas. ... more

Murata and Cypress collaborate on Type 1LV module

Murata has announced an upcoming collaboration with Cypress Semiconductor Corporation, to develop the Type 1LV (CYW43012) modular solution for Wi-Fi and Bluetooth applications, with controlled power ... more

Analog Devices announces industrial automation solutions to help accelerate the path to Industry 4.0

Analog Devices, Inc. (ADI) today announced a broad range of solutions within its advanced Industry 4.0 roadmap aimed at helping industrial equipment OEMs accelerate their path to Industry 4.0. These ... more

Qorvo’s QPL7210 Receive Module, Now at Mouser, Offers Integrated Coexistence BAW Filtering for 802.11ax Applications

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the QPL7210 2.4 GHz ... more

Lattice Semiconductor Further Expands CrossLink Applications with Modular IP Cores

Latest IP cores enable more flexible video bridging capabilities for consumer, industrial and automotive applications.

Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of ... more

Mouser Electronics Now Shipping Maxim’s MAX14819 Dual IO-Link Master Transceiver for Industry 4.0

Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the MAX14819 IO-Link ... more

Cypress’ S71KL512SC0 HyperFlash and HyperRAM multi-chip package now at Mouser

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is now stocking the S71KL512SC0 HyperFlash™ and HyperRAM™ Multi-Chip Package (MCP)... more

Mouser now offering highly anticipated Microsemi PolarFire FPGA Evaluation Kit

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now offering the PolarFire Evaluation Kit from Microsemi, which allows ... more

Simple and efficient drive operation and configuration

At the 2017 LogiMAT China exhibition, NORD DRIVESYSTEMS showcases a very user-friendly drive electronics innovation – NORDAC LINK field distribution systems, available as frequency inverters and ... more

New features for icom Data Suite: S7 connectivity, arithmetic and aggregation functions

INSYS icom, leading technology partner for M2M and IoT communication solutions, has added a "Siemens S7 Application Connector", logical and mathematical functions for data processing, and a command ... more

Spirent landslide delivers a smarter approach to managing network performance

Spirent Communications announced the introduction of Spirent Landslide EDGE and Spirent Landslide CORE test solutions that provide mobile network operators the ability to deploy and operate in real time to maximize operational efficiencies more

New Belden unmanaged switch makes it easy to send data over long distances

Hirschmann’s SPIDER III Standard Line Switches Uses Ethernet Technology for Smooth, Uninterrupted Communications  more

New solution enables mobility and end-to-end interoperability testing of voice over Wi-Fi and Wi-Fi offload on a single test platform

Spirent Communications hasannounced a new capability to evaluate the Wi-Fi Offload and Voice over Wi-Fi (VoWiFi) performance of mobile devices on the Spirent Elevate Test Framework. The new solution ... more

Midrange processors feature high-end enhancements & speed

Qualcomm has announced that it has introduced four Snapdragon processors, aimed at enhancing user experience and connectivity for high-performance and high-volume mobile devices. The Snapdragon 620 ... more

 
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