Intel begins its shipment of 10nm Agilex FPGAs
Published: 30 August 2019 - Christian Lynn
Intel today announced that it has begun shipments of the first Intel Agilex field programmable gate arrays (FPGAs) for early access programme customers. Participants in the early access program include Colorado Engineering, Mantaro Networks, Microsoft and Silicom. These customers are using Agilex FPGAs to develop advanced solutions for networking, 5G and accelerated data analytics.
The Intel Agilex family combines several Intel technologies, including the second-generation HyperFlex FPGA fabric built on Intel’s 10nm process, and heterogeneous 3D silicon-in-package (SiP) technology based on Intel’s embedded multi-die interconnect bridge (EMIB) technology. This amalgamation of advanced technologies allows Intel to integrate analogue, memory, custom computing, custom I/O and Intel eASIC device tiles into a single package, along with the FPGA fabric. Intel delivers a custom logic continuum that allows developers to seamlessly migrate their designs from FPGAs to structured ASICs.
Doug Burger, technical fellow, Azure Hardware Systems at Microsoft, had this to say: “The Intel Agilex FPGA product family leverages the breadth of Intel innovation and technology leadership, including architecture, packaging, process technology, developer tools and a fast path to power reduction with eASIC technology. These unmatched assets enable new levels of heterogeneous computing, system integration and processor connectivity and will be the first 10nm FPGA to provide cache-coherent and low latency connectivity to Intel Xeon processors with the upcoming Compute Express Link.”
For more information, such as specifications, on Intel's Agilex FPGA family, click here.