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RTI joins the Autonomous Vehicle Computing Consortium (AVCC)

RTI joins leading OEMs, Tier 1 suppliers and semiconductor companies in their collaborative effort to accelerate the delivery of safe and affordable autonomous vehicles at scale, collaborating with ... more
Automotive

OKW introduces a wall holder for its Connect range of enclosures

OKW's new wall holder looks to secure devices safely when not in use.

The new holder is perfect when the Connect enclosure is specified as a wired (or wireless) remote control for applications such ... more

Enclosures

Smiths Interconnect unveils the CTX Series

Smiths Interconnect has announced the release of its new CTX high frequency wire-bondable chip termination series, optimised to combine high frequency and power in a small package.

The new CTX ... more

RF & Microwave

Leman Micro Devices brings its V-Sensor forward for medical applications

Leman Micro Devices (LMD) announces that its V-Sensor, which together with the company’s e-Checkup app, measures five vital signs – blood pressure, body temperature, pulse rate, respiration rate and ... more
Medical

International Women's Day beckons and it begs the question: why aren't there more women in tech?

International Women’s Day rolls around every year, and although it serves to highlight the inequalities that women continue to face, I believe there needs to be more day to day consciousness to ... more
News

Cissoid looks to embolden e-mobility with its new 3-Phase SiC MOSFET

Cissoid's new 3-Phase SiC MOSFET Intelligent Power Module (IPM) platform offers an all-in-one solution, its SiC MOSFET possessing water cooling capabilities and built-in gate drivers.

Co-optimising ... more

Power

Würth Elektronik L78x-compatible power module meets the demands of the industrial voltage network

A new generation of MagI³C FDSM power modules, with fixed 3.3 or 5V output voltages, are now also available with an input voltage of 36V, following on from versions with maximum input voltages of 28 ... more
Power

Electrons, not ions, provide superior plasma etching of nanoscale semiconductor devices

In semiconductor fabrication, the traditional approach to dry etching has been to utilise RF plasma to bombard the surface of the wafer with positive ions to remove material between masking layers.

... more

Component Design

FiDUS Power's modular configurable PSUs offer size benefits

FiDUS Power announces the availability of the NEVO range of modular configurable power supplies, including medical variants.

Both sizes of the NEVO power supplies are available, complying to ... more

Power

Super Micro Computer introduces new category of 5G Edge servers for IP65 cell towers

Supermicro introduces its IP65 enclosure-based servers for 5G RAN, AI inferencing, and other Edge-focused applications based on Intel Xeon D and 2nd Gen Intel Xeon processors, and broad configuration ... more
Communications & Networks

IBASE announces its SMARC 20 CPU Module in collaboration with NXP

?IBASE Technology, a manufacturer of application specific embedded computer platforms, has announced the release of the RM-N8MMI SMARC 2.0 CPU Module built with NXP Arm Cortex-A53 i.MX 8M Mini Quad 1.... more
Advertorial articles

Panasonic Factory Solutions announces new partnership with Ankatek

Panasonic Factory Solutions, a division of Panasonic Industry Europe, and Ankatek, one of the largest technical distributors of high-tech capital goods for electronics manufacturing in Turkey, ... more
Distribution

Schaffner's cosine evo filters get a 50Hz extension

The new ecosine evo filters, FN 3440/41-250-119 and FN 3450/51-315-119, follow the same features as the existing ecosine evo series: with and without DC-link choke, achieving five per cent THDi at ... more
Power

ODU reveal their latest AMC connectors with Cat-6A performance

As the demand for data - faster transmission, extended bandwidth - increases drastically, technology markets are striving to match this, such as in the area of interconnection: current standard ... more
Interconnection

Toshiba's new SOI process improves RF switch ICs

Toshiba has improved the characteristics of their silicon on insulator (SOI) process technology for RF switch /LNA ICs. The process, known as TaRFSOI (Toshiba RF SOI) SOI-CMOS (silicon on insulator ... more
Embedded Technology

1500 Series universal smart enclosure - Engineered Excellence in a Box

CamdenBoss’ latest addition to their plastic enclosure range is the highly anticipated 1500 series universal smart enclosure. With many features and benefits that deal with everyday issues faced by ... more
Advertorials

Meet the Modification Experts

Best of class medical and industrial power supplies from 40 to 1.000 Watts

Strength in Modified Standard Design and flexible state of the art production under one roof Nuremberg/Mumbai – EOS ... more

Advertorials

Solectrix is Embedding your Visions

New High-End Embedded Solutions for Automotive, Aerotech, Medical and more at Embedded World Show 2020

The embedded-solution experts of German Solectrix GmbH are providing solutions in the field of ... more

Advertorials

New EASYTEC Flanged Enclosures For Sensor Electronics

OKW has launched EASYTEC, a new range of flanged plastic enclosures for modern sensor electronics. The integrated flanges permit easy mounting on poles/tubes or flat surfaces with cable ties or ... more
Advertorials

Marvell and Analog Devices work together to augment 5G radio solutions

Analog Devices and Marvell have announced a technology collaboration, leveraging Marvell’s 5G digital platform and ADI’s wideband RF transceiver technology to deliver fully optimised solutions for 5G ... more
RF & Microwave

 
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