Toshiba introduces serial interface NAND flash memory for embedded applications
Published: 2 November 2015 - Lisa Peake
Toshiba Electronics Europe has launched a new line-up of 24nm SLC NAND flash memory products for embedded applications that are compatible with the widely used Serial Peripheral Interface (SPI). Wide ranging applications for the new Serial Interface NAND include consumer applications such as flat-screen TVs, printers, wearable devices, and industrial applications including industrial robots.
The new line-up spans densities of 1Gbit, 2Gbit and 4Gbit and are available in either SOP (10.3mm x 7.5mm) or WSON (6.0mm x 8.0mm) packages. Each density / device combination is available with a choice of input voltage compatibility of either 1.8V or 3.3V.
High-speed sequential read functions, embedded ECC (Error Correction Code) with bit flip report function and embedded data protection features ensure data can be accessed quickly while being stored safely and securely.
The Serial Peripheral Interface enables the devices to be controlled using just six pins, giving users access to an SLC NAND flash memory with a low pin count, small package and large capacity. Serial Interface NAND has a much lower cost per bit than the NOR flash memory solutions traditionally used in embedded applications.
In order to enable embedded devices to match the increased functional requirements of customers, demand is increasing for larger memory densities. This is driving demand for increased storage of software (including boot up programs, firmware, and embedded OS) and data (including log data) and causing product designers to turn to SLC NAND flash memory for its high density and high reliability.
With an operating temperature range of -40°C to +85°C the devices are suitable for the vast majority of consumer and industrial embedded applications. Sample shipments of the WSON and SOP devices starts this month, with mass production targeted to begin in December 2015. Products housed in a BGA package are also in development.