Micro Matters

 

Cohu launches next generation pick-and-place handler

Published: 18 February 2015 - Marianne Evans
Cohu has announced the introduction of Eclipse, a high speed pick-and-place handler designed to test up to 16 Integrated Circuits (ICs) in parallel, at temperatures up to +130 Celsius, and with throughput up to 13,000 units per hour.
 
“Eclipse is designed to satisfy high-mix production requirements of test subcontractors, allowing them to leverage their existing device kit infrastructure while utilising our high performance thermal technology that is considered the benchmark for testing mid to high power processors”.
 
Eclipse delivers scalable performance for testing a wide range of semiconductors in singulated form, from analog ICs with short test times that require extremely high handler throughput to large multi-site test applications of digital ICs. The new handler accommodates package sizes from 3x3 mm up to 55x55 mm in various forms including CSP, BGA, QFP, QFN and others.
 
The initial Eclipse configuration is for testing devices that power next generation smartphones and tablets. The handler features the company’s proprietary T-Core thermal controller and an on-board liquid cooling system that provides precise, multi-site temperature management of power dissipative ICs, optimising test yield of next generation mobile processors.
 
“Eclipse is designed to satisfy high-mix production requirements of test subcontractors, allowing them to leverage their existing device kit infrastructure while utilising our high performance thermal technology that is considered the benchmark for testing mid to high power processors,” said Luis Müller, president and CEO of Cohu.
 
The integration of T-Core into Eclipse enables customers to acquire a scalable solution for testing both standard ICs and thermal dissipative processors in an all-in-one cost-effective handler platform. 
Source: Micro Matters


 
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